April 2024 - ASMD/HPAD/AHAD: Our chapter on Haynes 282, originally published in 2010, has recently been updated by author Dwaine Klarstrom. This update contains 18 new or updated tables and figures. One of the major developments with Haynes 282 has been the development of a new single-step age practice which is indicated for application in Advanced-Ultra Super Critical, Supercritical CO2, and other ASME Boiler Code uses. Extensive Mechanical and Thermal Properties data have been added, including new creep-rupture and fatigue crack growth behavior.


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What we do:

CINDAS LLC provides critically evaluated materials properties databases for thermal, mechanical, electrical, physical and other properties of various materials including aerospace alloys. We provide web-based applications for searching and comparing continually updated data.

The Aerospace Structural Metals Database (ASMD) is the industry benchmark for materials properties of high strength, lightweight alloys used in the aerospace and other industries.

The Aerospace and High Performance Alloys Database (AHAD) includes all data from the ASMD, as well as that in the High Performance Alloys Database (HPAD); the HPAD contains materials properties data focused on the specific needs of the high performance industries such as oil/gas, chemical processing, power generation, and transportation industries, and includes detailed data on corrosion performance and joining.

The Thermophysical Properties of Matter Database (TPMD) contains information on thermophysical properties.

In May 2021 CINDAS LLC introduced the Cryogenic and Low Temperatures Database (CLTD). It offers material characteristics in the cryogenic and low temperature ranges. The CLTD consists of thermophysical, mechanical, electrical and other properties of over 2,000 materials, mostly in the temperature ranges of 0 K to 273 K. Initial data is from both NIST data resources as well as CINDAS data.

Our latest materials properties database was introduced in December 2022: an even bigger database for microelectronics and composite materials, the Microelectronics and Composite Materials Database (MCMD). This database is the upgraded and expanded version of the Microelectronics Packaging Materials Database (MPMD). It contains everything previously in the MPMD (data and information on thermal, mechanical, electrical and physical properties of electronics packaging material) plus much new data on more than 200 composite materials, including ceramic matrix composites, both particulate and whisker reinforced as well as GLARE materials (Glass Laminate Aluminum Reinforced Epoxy also known as GLAss REinforced laminate). As of 1 January 2023, the MCMD replaces the MPMD.

Please try our free product demos of the web-based applications for the AHAD, ASMD, CLTD, HPAD, MCMD, and TPMD. To learn more about the individual databases, use the Products tab above.

Web-based database graphing functions include:

  • Advanced material name or property based searching
  • Interactive graphing capability
  • Zoom feature allows more detailed viewing
  • Coordinates highlighted when hovering over data points
  • Unit conversion and logarithmic graphing
  • Export graphs to JPG, PNG or PDF
  • Full text descriptions of data