Reliable source of detailed data on corrosion testing and joining

The go-to source for high performance alloy materials properties

The most comprehensive compilation of thermophysical properties data available

Provides cryogenic data needed for aero and deep space applications as well emerging technologies

Evaluated properties and proprietary experimental data for a wide variety of materials used for semiconductor device packaging

Damage tolerant design data, helping professionals determine the difference
between 4 more and 1 more successful cycles

Learn how fabrication flowpaths affect materials selection

Powerful database for industries requiring high performance alloy data

The go-to source for low density-high modulus materials property data

The most reliable source of thermal radiative data available

Evaluated properties and proprietary experimental data for a wide variety of materials used for semiconductor device packaging

Newsletter |Vol 19 - May 2023

Our Mailing Address

THE CONVERGENCE CENTER
101 FOUNDRY DRIVE, SUITE 4700
WEST LAFAYETTE IN 47906-3445 USA