Newsletter | Vol 1 - July 2014
In this newsletter...
Light Metal Age - Magnesium[Permalink]
Since its first publication in May 1943, Light Metal Age magazine has been collating the progress and the economic ups-and-downs of magnesium, the lightest of the commodity light metals. Starting with the first issue of Light Metal Age, its founder, Roy Fellom Jr. wrote about the magneisum production processes of the times (much the same today). This article summarizes the progress made in magneisum technology through the decades, with emphasis on the use of magnesium. The year 1943 was a watershed year for magnesium production, with worldwide production peaking that year due to the war effort and then falling precipitously at the end of WWII by a factor of 50 times. It took decades for the market to recover to where it is today-some four times the worldwide production level during its peak in WWII-with credit due in large part to the remarkable properties of this light metal and to the outstanding work of magnesium technologists in creating alloys and processes that offer advantages and value in commercial applications. These trends in magnesium technology as well as the uses of magnesium have been documented in Light Metal Age. Upon cursory examination of the many decades of magnesium usage, we at first sense a case of "history repeating itself" but, digging deeper into the magnesium archives, we see how critical the progress made by magnesium technologists have been in expanding its use in a wide variety of markets.
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ASMD - Gold Standard for the Aerospace Market[Permalink]
HPAD - New Product for a New Market[Permalink]
- View the HPAD Alloy Sheet
Electronics and Thermal Packaging Portal, a World Scientific Collaboration[Permalink]
The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. It is in this light that World Scientific, the leading publisher in thermal and electronics packaging, aims to publish top content to meet the need of researchers and practitioners alike, starting with the Encyclopedia of Thermal Packaging, and the Series in Advanced Integration and Packaging. The contributing authors to this series include Prof. Madhavan Swaminathan, recipient of the 2014 CPMT Outstanding Sustained Technical Contribution Award. (Taken from electronics and thermal packaging portal.)
CINDAS LLC is contributing data from the Microelectronics Packaging Materials Database (MPMD) to the Encyclopedia of Thermal Packaging. As one of the world's leading sources of microelectronics packaging materials data, the MPMD will be a great resource for the Encyclopedia of Thermal Packaging. The MPMD contains data and information on thermal, mechanical, electrical and physical properties of electronics packaging materials. It is available in a Web-based format. The database is continually updated and expanded. The MPMD contains over 1025 materials, 388 properties, and contains approximately 22,500 data curves. You can view additional information about the MPMD at the CINDAS LLC website.
Ask an Expert[Permalink]
Blast from the Past 1986 - Materials Established at CINDAS/Purdue University[Permalink]
A computerized materials properties numerical data system has been developed and established at the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University, which is a comprehensive, one-line, interactive, menu-driven, user-friendly, expert data system. This data system contains both critically evaluated reliable reference data and experimental data on the thermophysical, mechanical, electrical, optical, and other properties of various types of materials. It permits both the search of data and information for specified materials and properties and the search for materials that meet a set of requirements specified by the user (i.e., computer-aided materials selection). It permits also the on-line functional manipulation, statistical analysis, and mthemtical study of the retrieved data. The development, operation, functions, scope, contents, and other features of the data system are presented and discussed.
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